Uptime/Downtime approx. 5.213/84.884, built in 2006, S/N 95022181648, dimensions approx. 800 x 1,250 x 1,100 mm; 3 x 400 V, 50/60 Hz, 3.3 A, 2.3 kVA, vacuum - 0.8 bar/1.5 Nm 3 /h, Compressed air 6.0 bar/20.0 l/min, nitrogen 1.0 bar/1.0 l/ min, bond force 70 N, Accuracy ± 10 µm @ 3 Sigma for sophisticated advanced packaging, Operating system (OS): Betelgeuse 41_iso, chip feed: wafer, Waffle pack, gel pack, feeder, with 8 inch wafer table, Wafer magazine, wafer scanner, process modules: Heated bond head, spindle dispenser, time-pressure dispenser, squeegee/dipping station; BIOS battery empty, Slide Fluxer defective (photoelectric sensors defective/missed), Blonde force sensor glass plate missing, integrated trackball damaged (external wingball mouse is installed as a functional replacement). Note: It is possible that BIOS, UEFI or installed drives are provided with an unknown password, which cannot be made available. Bid base: piece Location: 76344 Eggenstein-Leopoldshafen