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Description
EVG 6/2 Mask Aligner for photolithographic exposure of round substrates (1-6 inch, max 10mm thick) and masks up to 6 inch. Manufactured approx. 1992. Capable of front/back side exposure (e.g., for membrane production). Various contact modes available.
🏭Industrial & ManufacturingEVG
EVG 6/2 Mask Aligner for Photolithography
EVG 6/2 mask aligner for photolithography, 1992, for 1-6 inch substrates.
Current Bid
13 €
Price checked 19/10/2026, 08:49:36
Lot ends in
20d 18h 55mLot Details
- Currency
- EUR
- Location
- Jena, DE
- Lot Ends
- 9 Nov 2026, 07:00:00
- Auction Ends
- 9 Nov 2026, 07:00:00
- Auction Started
- 19 Oct 2026
- Lots in Auction
- 1
