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Description
2019 Ultrasonic Wirebonder M17XL semiconductor packaging equipment.
🏭Industrial & ManufacturingUltrasonic
ULTRASONIC WIREBONDER M17XL 2019 Auction: 2828/IN/AU/2026
Starting Bid
5.801 €(25 062 zł)
No bids
Price checked 27/10/2026, 12:05:04
Lot ends in
6d 20h 17mLot Details
- Currency
- PLN
- Location
- Komorniki, PL
- Lot Ends
- 3 Nov 2026, 12:00:00
- Auction Ends
- 3 Nov 2026, 12:00:00
- Lots in Auction
- 1